Process Integration Engineer

Job Title: R D Engineer - Process Integration

Location: Covington, GA

Job Type: Full-Time

About Us: Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.

Job Description:

We are seeking a highly skilled and experienced Process Integration Engineer to join our team. The successful candidate will be responsible for orchestrating and integrating critical process steps, such as:

dielectric materials selection and application

lithography

wet + dry clean/etch/develop processes

PVD and electroplating

into a coherent, manufacturable process flow for fine-pitch, next-generation packaging architectures. You will support finalizing various Process Integration Plans, defining design rules, managing process window tradeoffs across module boundaries, and be the primary technical decision-maker to help navigate constraints in the full process flow. You will work daily with the lithography, wet/dry process, dielectric, and plating engineers, translating their individual process capabilities into a working end-to-end flow, while also engaging with device/package design teams on architectures feasibility. In an early-stage environment, this role carries enormous influence on the finalized architecture and build-up decisions.

Key Responsibilities:

Oversee process integration, manage scheduling, and provide comprehensive progress reports to upper management.

Develop and implement process integration strategies to optimize production yield and efficiency.

Coordinate with cross-functional teams to ensure seamless integration of processes.

Monitor and analyze process performance, identifying areas for improvement.

Ensure compliance with industry standards and safety regulations.

Troubleshoot and resolve process-related issues in a timely manner.

Maintain detailed documentation of processes and procedures.

Generate innovative ideas for patent filings.

Required Skills:

Demonstrated experience integrating multi-step package build up process flows (SAP and/or damascene), from lithography through metallization and dielectric build-up

Strong working knowledge across the full unit-process stack: photolithography, wet/dry etch, PVD seed deposition, dielectric film processing, and electroplating, sufficient to identify cross-process interactions and failure handoffs

Experience authoring or owning Process Integration Plans, design rules (line/space, via CD, registration/overlay budgets, taper angle specs), and process flow documentation

Track record of root-causing yield or reliability excursions that span multiple process modules (e.g., seed undercut driving downstream plating defects, via CD variation driving lithography-etch mismatch)

Statistical process control and DOE methodology for multi-variable, multi-step process optimization

Strong cross-functional collaboration skills; ability to translate unit-process engineer findings into integration-level decisions and vice versa

Familiarity with metrology and failure analysis techniques across the flow (SEM, FIB cross-section, CD-SEM, overlay metrology, electrical test)

Understanding of registration, overlay, and CD budget allocation across sequential build-up layers

Fluent in English; proficiency in Korean is a plus.

Preferred Skills

Experience with glass core substrates

Direct experience scaling fine line/space RDL, including via CD control and multi-layer registration challenges

Experience with any next-gen architecture enablement: glass core/glass interposer integration, panel-level processing, co-packaged optics, hybrid bonding, or fan-out heterogeneous integration

Familiarity with bifurcated roadmap considerations (high-performance AI/HPC vs. cost-optimized mainstream paths) and how that shapes architecture and material tradeoffs

Experience building DFM (design-for-manufacturing) guidelines in collaboration with package design teams

Knowledge of reliability qualification frameworks (JEDEC, IPC) as they constrain integration choices

Familiarity with new equipment or process technology evaluation and incorporation into an existing flow (e.g., panel-level CMP, advanced laser/plasma drill, novel dielectric chemistries)

Experience presenting integration roadmaps or technical reviews to leadership or cross-functional stakeholders

Publication, patent, or conference presentation record (e.g., ECTC) in RDL/interconnect integration

Education

Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, or related field preferred

M.S. with 5+ years of relevant process integration or process engineering experience considered (integration roles …