Semiconductor Fabrication Technologist/Senior Semiconductor Fabrication Technologist

We have an opening for a Semiconductor Fabrication Technologist or a Senior Semiconductor Fabrication Technologist . You will provide technical support to scientists and senior technical personnel in semiconductor-based technologies including chemical and material sampling, sample preparation, analysis, characterization, experimental development, experimental execution, data collection, interpretation, reporting, and management of hazardous wastes. Other responsibilities are ES&H compliance, code regulation or standards compliance, and working on complex technical projects. This position is in the Micro & Nano Technology Section (MNTS) of the Materials Engineering Division (MED), within the Engineering Directorate.

This position requires full-time on-site presence due to the nature of the work.

This position will be filled at either level depending on your qualifications. Additional job responsibilities (outlined below) will be assigned if you are selected at the higher level.

In this role you will

Perform general microfabrication of devices using MEMS/semiconductor-based technologies, such as: Photolithography, Wet Chemistry, Plasma Etching, Thin Film Deposition (metals, dielectrics, polymers) sputtering, E-Beam, ALD, and Wafer Dicing.

Measure, test, and analyze materials and substances following standard, and at times unique, procedures and techniques using analytical instruments such as microscopes, SEM, profilometers, and other analytical equipment.

Provide solutions to technical problems. Support scientists with decision making to establish or modify techniques and procedures to choose appropriate work methods.

Responsible for the safe and effective operation, testing, maintenance, and calibration of major scientific instruments and apparatus.

Write equipment standard operating procedures.

Work in a Class 100 cleanroom.

Work with hazardous chemicals & gases and manage hazardous waste.

Perform other duties as assigned.

Additional job responsibilities at the 504.3 Level

Provide advanced troubleshooting skills and independently identify complex technical problems and implement solutions.

Create safety documents, Standard Operating Procedures (SOPs), and other documentation, including test reports.

Acquire, analyze and may interpret moderately complex data.

Ability to obtain and maintain a U.S. DOE Q-level security clearance, which requires U.S. citizenship.

Associate degree in Microtechnology, Chemistry/Materials, Electronics or Engineering, or an equivalent combination of education and related experience.

Experience in wet chemistry, photolithography, thin film deposition of materials, and plasma etching.

Experience acquiring and analyzing basic data, keeping laboratory notebook, preparing data summaries of results, and helping to identify problems.

Intermediate skills and understanding of relevant technologies and processes, including interpreting, and utilizing laboratory equipment.

Proficient computer skills including knowledge of Microsoft Office.

Effective communication, interpersonal, and teamwork skills and abilities.

Demonstrated ability to work with and effectively lead a multidisciplinary team with a commitment to engineering and technical excellence, customer service, quality, efficiency, cost, and schedule.

Demonstrated ability to exercise sound judgment in high-consequence safety environment, solving moderately complex problems in a multi-tasked environment with minimal instruction and supervision.

Additional qualifications at the 504.3 level

Advanced specialized technical expertise in one or more areas of chemistry, materials science, engineering, or microfabrication.

Ability to troubleshoot complex microfabrication problems.

Significant experience with advanced analytical, problem-solving, and decision-making skills to develop creative solutions to complex problems.

Advanced administrative and organizational skills include the use of computers and software such as MS-Word, Excel, PowerPoint, and similar applications.

Qualifications We Desire

Experience with packaging tools; wire bonding, flip chip bonding, dicing, epoxy bonding.

Background maintaining SEM tools.

Experience with proper handling and storage of classified media.

Experience handling hazardous materials.

Pay Range

$43.55 - $63.97 Hourly

$43.55 - $53.36 Hourly for the 504.2 level

$52.23 - $63.97 Hourly for the 504.3 level

This is the lowest to highest salary in good faith we would pay for this role at the time of this posting. Pay will not be below any applicable local minimum wage. An employee’s position within the salary range will be based on several factors including, but not limited to, specific competencies, relevant education, qualifications, certifications, experience, skills, seniority, geographic location, performance, and business or organizational needs.

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Position Information

This is a Career Indefinite position, open to Lab employees and external candidates.

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